BAS28 TR TIN/LEAD

BAS28 SURFACE MOUNT SILICON DUAL, ISOLATED HIGH SPEED SWITCHING DIODES w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR BAS28 consists of two electrically isolated ultra-high speed silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy molded SOT-143 surface mount case. This device is designed for high speed switching applications. MARKING CODE: A61 or JTW   SOT-143 CASE MAXIMUM RATINGS: (TA=25°C) Continuous Reverse Voltage Peak Repetitive Reverse Voltage Continuous Forward Current Peak Repetitive Forward Current Peak Forward Surge Current, tp=1.0μs Peak Forward Surge Current, tp=1.0ms Peak Forward Surge Current, tp=1.0s Power Dissipation Operating and Storage Junction Temperature Thermal Resistance ELECTRICAL SYMBOL IR IR SYMBOL VR VRRM 75 85 V IF 250 mA IFRM IFSM 500 mA 4.0 A IFSM IFSM 2.0 A 1.0 A PD TJ, Tstg 350 mW -65 to +150 °C ΘJA 357 °C/W CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) TEST CONDITIONS MIN MAX VR=25V, TA=150°C 30 UNITS μA VF VR=75V VR=75V, TA=150°C IF=1.0mA VF IF=10mA 855 mV VF IF=50mA 1.00 V VF IF=150mA 1.25 V CJ VR=0, f=1.0MHz 2.0 pF trr Qs VFR IF=IR=10mA, Irr=1.0mA, RL=100Ω IF=10mA, VR=5.0V, RL=500Ω 6.0 ns 45 pC IF=10mA, tr=20ns 1.75 V IR 1.0 UNITS V μA 50 μA 715 mV R8 (19-September 2018) BAS28 SURFACE MOUNT SILICON DUAL, ISOLATED HIGH SPEED SWITCHING DIODES SOT-143 CASE - MECHANICAL OUTLINE PIN CONFIGURATION LEAD CODE: 1) Cathode D1 2) Cathode D2 3) Anode D2 4) Anode D1 SYMBOL A B C D E F G H J K L DIMENSIONS INCHES MILLIMETERS MIN MAX MIN MAX 0.003 0.008 0.08 0.20 0.006 0.15 0.000 0.005 0.01 0.13 0.035 0.045 0.89 1.14 0.110 0.120 2.79 3.04 0.075 1.90 0.083 0.102 2.10 2.60 0.047 0.055 1.19 1.40 0.012 0.020 0.30 0.50 0.030 0.037 0.76 0.93 0.067 1.70 SOT-143 (REV: R3) MARKING CODE: A61 or JTW R8 (19-September 2018) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)